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A new study by researchers from Microsoft and WSP Global, published in Journal Nature, reveals that advanced cooling methods can significantly cut the environmental footprint of data centres.
Aspect | Air Cooling | Direct-to-Chip (DTC) Cooling | Immersion Cooling |
Cooling Medium | Air circulated via CRAC/CRAH, fan walls, or in-row units | Liquid (typically water or treated coolant) via cold plates | Dielectric fluid (single-phase or two-phase) |
Heat Transfer Efficiency | Low – limited by air’s low thermal conductivity | High – direct contact with hot components via cold plates | Very High – fluid surrounds all components for uniform heat removal |
Component Coverage | Entire rack environment including all equipment | Focused on CPUs, GPUs; others still cooled by air | Full system submersion, all heat sources cooled |
Power Density Support | Up to ~20 kW/rack (with optimization) | Up to ~50–100 kW/rack | Up to 500 kW/rack or more |
Maintenance & Compatibility | Easier maintenance; universal compatibility | Moderate complexity; limited vendor support | High complexity; requires specially-prepared hardware |
Deployment Complexity | Simple and widely adopted | Moderate – requires fluid loops, plates, leak management | High – needs tanks, fluid handling, leak detection |
Sustainability Potential | Lower – high fan energy, limited heat reuse | Medium – less energy use, some heat reuse possible | High – efficient energy use and better heat reuse potential |
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